SAMPE Workshop on Optoelectronic and MEMS Packaging
Opportunities for Advanced Materials in Thermal Management and Microelectronic, Optoelectronic and MEMS Packaging
Dr. Carl Zweben
Composites Consultant
62 Arlington Road
Devon, PA 19333-1538
Phone: 610-688-1772
Fax: 610-688-8340
E-mail: c.h.zweben@usa.net
SAMPE 2002
May 12-16,2002
Long Beach, California
Electronic packaging is a $100 billion international market that will double in ten years. Optoelectronic and MEMS packaging continue to expand rapidly. There are great needs and opportunities for advanced materials in these applications. In addition, recent development of carbon fiber-reinforced polymers with high thermal conductivities opens up new markets for injection molded plastics.
Current electronic packaging materials are rapidly becoming outdated. For example, E-glass/epoxy, which is widely used in printed circuit boards, dates from the vacuum tube era. In particular, there is a critical need for materials that will meet the severe requirement for heat removal resulting from increasing functionality and packaging density. The criticality of the thermal management problem in microprocessors was highlighted in the April 2001 issue of Forbes.
Advanced monolithic and composite materials have been and are continuing to be developed to meet the needs of new packaging applications. Some, including both polymer matrix composites (PMCs) and metal matrix composites (MMCs), are now in high volume commercial and aerospace applications, including laptop computers, servers, cellular telephone base stations, power modules for hybrid vehicle such as the Toyota Prius, printed circuit board heat sinks and microwave packages.
The unprecedented high thermal conductivities of new PMC molding compounds are enabling their use in a wide array of new applications in addition to electronic packaging, such as motor covers that were previously made of die cast aluminum.
In addition to high thermal conductivity, tailorable coefficient of thermal expansion (CTE) is a critical requirement for optoelectronic and MEMS packaging. Advanced composites uniquely provide a means to meet both of these requirements.
Advanced monolithic and composite materials commercialized to date provide revolutionary improvements over conventional thermal management and packaging materials, including: thermal conductivities up to 4 times that of copper; reduced thermal stresses; weight savings as high as 85%; outstanding strength and stiffness; and low cost, net shape fabrication processes.
This workshop provides design, manufacturing, cost and market information on the many and steadily increasing number of advanced monolithic and polymer matrix-, metal matrix- and carbon/carbon composite packaging and thermal management materials. We consider applications in all packaging levels, such as carriers, modules, heat sinks, enclosures and support structures. We also examine the enormous potential in non-packaging applications for which thermal conductivity is critical.
ABOUT THE INSTRUCTOR
Dr. Carl Zweben has over 30 years' experience in the composites industry, and has been involved in the development and application of electronic packaging materials since the 1970s. Now an independent consultant, he previously was Advanced Technology Manager and Division Fellow at GE Astro Space (later sold to Lockheed Martin). Other affiliations have included Du Pont, JPL and the Georgia Institute of Technology NSF Packaging Research Center. He is a fellow of SAMPE, ASME and ASM International, and an Associate Fellow of AIAA. He has been a Distinguished Lecturer for AIAA and ASME. He was the first person, and one of only two, to receive the GE One-in-a-Thousand and Engineer of the Year Awards. He has edited and contributed to numerous Encyclopedias and Handbooks, including the six-volume Comprehensive Composite Materials, and has written and lectured widely. He has directed and lectured at over 150 short courses, worldwide. Clients have included Nokia, Reynolds Metals Company, Hitco Carbon Composites, Boeing, Hughes, General Dynamics, COM DEV, E-Systems, ITT, Knolls Atomic Power Laboratory, Princeton University High Energy Physics Group, DOD Advanced Materials and Processes Technology Information Analysis Center (AMPTIAC), US Air Force, US Army and other organizations.